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PCB Pad Layout
PCB Pad Layout
Pads should be laid out according to the solder column dimensions of the CG package. Refer to the CG
package drawing and the SoC Products Group application note, CCGA. Since the socket adapter ’s
overall size is larger than the actual CG package, you must consider the size difference between the
socket adapter and CG package during board layout, particularly if the same board will be used for both
prototyping and production. Figure 10 shows PCB pad layout specifications.
a) Solder Mask Window
(Diameter)
b) Mounting Pad
(Diameter)
d) Via Solder Mask Window
(Diameter)
A
A
h
45? Typical
b) Diameter
c) Dia
Solderable
Surface
Section A–A
e) Via
(Diameter)
0.3mm Line
Feature 1.27mm Pitch 1.00mm Pitch
a 0.851mm 0.8mm
b
0.749mm
0.7mm
f) Land
(Diameter)
g) Typical
c
d
e
f
g
h
0.72mm
0.483mm
0.305mm
0.56mm
0.635mm
0.635mm
0.67mm
0.38mm
0.20mm
0.46mm
0.50mm
0.50mm
Figure 10 ? PCB Pad Layout Specifications
G) Screws X16 #0–18,1/4L
A) Socket Lid
H) Alignment Pins X2
B) FG896 Package
FG
48
4
C) Socket Interposer
40.00
D) Socket Housing
FG484
40.00
F) Ceramic Adapter
Unit: mm
1 4 . 9 6
1 4 . 0 3
Figure 11 ? CG624 to FG484 23x23 Adapter Socket Outline Drawing
7
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